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Company Introduction
Mingzhenghong Electronics Co., Ltd.
Founded in 2011, Mingzhenghong Electronics Co., Ltd. has established an excellent reputation in the high-precision printed circuit board (PCB) industry with high-quality products and services. From the head office in Huizhou to the branches in Shenzhen and Hong Kong, our annual production capacity has jumped from 50,000 square meters to 180,000 square meters, showing continuous growth and development potential. We focus on providing a series of products including single-sided, double-sided, multi-layer PCB, FPC, soft-rigid combination board, copper substrate, aluminum substrate, etc., and are committed to serving customers in many important fields such as communications, medical, education, industrial automation, automobile, 5G and new energy.
Mingzhenghong adheres to the business philosophy of "persistent innovation, continuous improvement, adherence to quality, value creation, mutual benefit and win-win", takes technological leadership and quality first as its purpose, and the entire production process adopts advanced equipment and automation technology to ensure high efficiency and excellent product performance.
We have passed ISO9001, ISO14001, UL, CQC, IATF16949 and other international certifications, and comply with IPC, RoHS, REACH and other industry standards. Through continuous technological innovation and quality improvement, the company is committed to becoming an ideal partner for global customers and strives to provide strong support and guarantee in the electronics market123456.
Tiger Nuts
8-layer soft and hard combined HDI board
The 8-layer high-density interconnect (HDI) rigid-flex board is an innovative circuit solution produced by Mingzhenghong Electronics Co., Ltd. with exquisite craftsmanship. This product uses FR-4 (ITEQ) and PI (polyimide) as the base material, which has both rigid and flexible characteristics. The size is 143.2 , the copper thickness of the inner and outer layers is 35 microns. Its minimum aperture reaches 0.125 mm, the minimum line width in the rigid area is 4mil, and the flexible area is 3mil; the line spacing also has high precision requirements, the rigid area is 3mil, and the flexible board area is 2mil. The surface of the product has been treated with the ENIG process and plated with a 3-micron thick gold layer to improve conductivity and corrosion resistance. The product has obvious features, integrating the complexity of multi-layer boards and the diversity of flexible circuit boards, and interconnecting through internal and external plated through holes. The green solder mask is used to cover the rigid area, and the yellow covering layer is used to cover the flexible board area. The appearance is neat and provides an excellent and reliable circuit platform for applications such as camera modules, medical instruments, and lighting systems. This product combines high-density wiring, multi-functionality and excellent durability, and is specifically designed to meet the needs of advanced electronic devices such as mobile communications and precision medical equipment.
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High-precision 34-layer laser blind hole PCB
The 34-layer high-precision multi-layer printed circuit board (PCB) produced by Mingzhenghong Electronics Co., Ltd. uses back-drilling technology and laser blind hole technology to ensure circuit connectivity and signal integrity. This product uses FR-4 TG180 ITEQ (IT180A) material, with a board thickness of 5.0mm, a minimum aperture of 0.3mm, and a minimum line width and line spacing of 4mil (0.1mm). The surface treatment adopts immersion gold process (ENIG), the cutting size is 350*350mm, the outer copper layer is 35um thick, and the inner copper layer is 18um and 35um thick. It has a high aspect ratio of 17:1, and according to the IPC-III standard requirements, the inside of the hole The copper thickness should be at least 25um. The twist and warpage ratio of this circuit board is controlled within 0.5%, which is far lower than the 0.75% requirement of the IPC-II standard. The product is specially designed for semiconductor test equipment, which requires high-precision control of the lamination process, and repair of circuits and solder masks is strictly prohibited. Strict quality control is implemented for the entire board to ensure reliable use by customers in high-performance electronic testing environments.
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Ultimate performance hybrid rigid-flex circuit board
This product is an 8-layer high-precision rigid-flex hybrid circuit board. It achieves superior mechanical and electronic performance through the combination of 6-layer rigid PCB and 2-layer flexible PCB. Using MITSUBISHI laser drilling equipment, it can accurately complete L1-L3, L6-L8 two-step laser hole processing, and implement blind buried via technology (VIA in pad process) to support advanced interconnection technology (HDI). The final treatment method of the board is ENIG (chemical gold plating), and the structure uses a blue solder mask layer and a yellow covering film. In product design, impedance control requirements are taken into consideration, and the stacking structure is designed based on a special layer sequence to ensure signal integrity. In addition, BGA resin hole filling processing is used to support small-pitch BGA packaging to ensure accurate and stable electrical performance. This product complies with environmental protection requirements such as RoHS and REACH, and is suitable for high-end electronic markets such as communications, medical, industrial automation and other fields.
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Tiger Nut Oil
Phnom Penh multi-layer high-precision PCB board
This product is a multi-layer printed circuit board (PCB) with a six-layer structure. The board thickness is approximately 2.2mm and the size is 165mm x 110mm. The outer and inner layers are made of 1 ounce copper foil, and the base material is combined with FR-4 and ROGERS materials to ensure excellent dielectric properties and thermal stability between the layers. The minimum drilling diameter is 0.2mm, and the minimum line width/line spacing is 4mil (0.1mm), meeting high precision requirements. The surface treatment is electroplated nickel gold (ENIG) plus edge copper plating process, which makes the copper layer continuous from the top to the bottom of the board and extends to at least one outer edge, which increases the reliability of the plug-in connection and reduces the risk of equipment failure. It is suitable for For applications requiring strong connection support. The product is usually used for connection protection of small computer boards and daughter motherboards. Green solder mask and white character printing enhance aesthetics and legibility. This product strictly follows international standards and is suitable for many important fields, such as communications, medical care, industrial automation, vehicle systems, etc., providing reliable support for electronic applications.
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High performance multi-layer PCB circuit board
The highly conductive multi-layer PCB circuit board provided by Mingzhenghong Electronics Co., Ltd. uses FR-4 base material and is compatible with 4-layer circuit layout design. The outer copper layer is 8OZ thick and the inner copper layer is 4OZ thick. It has excellent conductivity and Thermal dispersibility. The product size is 182.6 x 164.52 mm, the plate accuracy is controlled within ±0.13mm, the minimum line width/line spacing can reach 0.3mm/0.3mm (12mil/12mil), the minimum aperture is 0.3mm (12mil), and the plate thickness specification is 2.0 mm±0.2mm. The surface treatment adopts immersion gold process to ensure excellent welding effect and long-term anti-corrosion performance. This product is widely used in power supply systems, smart metering, communication equipment, security monitoring, LED radiators, automotive electronics and other fields to meet the needs of high-density integrated circuit design and high-power electronic equipment. Our thick copper PCB product line supports outer copper thickness up to 12OZ and inner copper thickness up to 8OZ, providing a strong and stable circuit foundation and assembly services for your various electronic hardware.
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Precision 30-layer HDI high-density communication circuit board
Using the high TG characteristics of IT-180A (ITEQ) material, this 30-layer HDI high-density interconnect circuit board has multiple laser drilling and compression bonding processing technologies. The board thickness is 2.0mm, the outer copper foil thickness is 1OZ, the inner copper foil thickness includes 1OZ and HOZ, the minimum through hole is 0.2mm, the minimum laser aperture can reach 0.1mm, and the minimum line width and line spacing are both 3mil ( 0.075mm), and the surface treatment adopts immersion gold (ENIG) process. This product is used in fields such as mobile phones and telecommunications, and is especially suitable for high-end smartphones that require high precision and tight layout. The product's blind and buried hole technology is widely used in high-end electronic products. The outer layer of visible ink is black and the silk screen is white, and complies with IPC-II standards and impedance requirements. The product not only has excellent electrical performance, but also has passed multiple certifications such as UL, TS16949, ISO9000, etc., ensuring the stability and reliability of product quality.
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News
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28
2024/09
Empowering medical device innovation: Overview of Ming Zhenghong’s high-specification multi-layer PCB technology
With the rapid advancement of medical technology, medical equipment has increasingly stringent requirements for the accuracy and stability of electronic hardware. Mingzhenghong Electronics Co., Ltd. is committed to ensuring the reliability of medical equipment in extreme environments through high-quality medical-grade precision multi-layer PCBs, combined with the most advanced technology and high-temperature resistant materials. This article will explore in depth how customized multi-layer PCBs meet the special needs of the medical industry, and analyze how Mingzhenghong's full service system and strict quality assurance can help medical device manufacturers to launch broader innovations.
28
2024/09
Leading the future of the aerospace industry - Mingzhenghong Electronics' aerospace-grade precision circuit board customization technology
With the rapid development of science and technology, the aerospace industry has increasingly stringent requirements for the precision of components. Mingzhenghong Electronics Co., Ltd. keeps pace with the forefront of technology and has launched aerospace-grade precision circuit boards specifically for the demanding European market. This article explores in depth the use of high-precision technical materials such as FR-4 TG150 and ROGERS 4350B, customization capabilities, and industry-leading innovative features of this circuit board. At the same time, it shows how Mingzhenghong Electronics has consolidated its market position in the aerospace field through this product and provides customers with reliable and continuous value.
28
2024/09
How to build a strong brand image in German medium and large electronic product manufacturing companies
Through effective market research and marketing strategies, we have successfully established brand awareness for medium and large electronic product manufacturers in the German market.
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Hot Products
8-layer soft and hard combined HDI board
High-precision 34-layer laser blind hole PCB
Ultimate performance hybrid rigid-flex circuit board
Multifunctional Flexible Printed Circuit Board (FPC)
Phnom Penh multi-layer high-precision PCB board
High reliability 26-layer HDI high density printed circuit board (HDI PCB)
High performance multi-layer PCB circuit board
Precision 30-layer HDI high-density communication circuit board
Communication-specific 24-layer high-frequency high-speed PCB circuit board
High durability hard gold edge connector eight layer PCB
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