Product Details
Product Introduction
Mingzhenghong Electronics Co., Ltd. specializes in providing multi-layer IC substrates and high-speed PCB customization services. The products use advanced circuit board manufacturing technology and have similar precision requirements to semiconductor manufacturing. The multilayer IC substrate is an important part of connecting the IC chip and the PCB. The interconnection between the chip and the circuit board is realized through conductive lines and holes. The IC substrate supports the carrier function of the circuit, protects, dissipates heat, and ensures uniform distribution of signals and power.
Advantages and features
- Advanced manufacturing: Using cutting-edge PCB manufacturing technology to meet the fine requirements of semiconductor levels, ensuring the high performance and stability of the circuit board. - Ultra-fine circuit design: supports minimum line width/spacing 0.075mm and via hole diameter 0.2mm, adapts to complex circuit design and improves signal transmission efficiency. - High-level IC substrate: supports up to 8-layer IC substrate design, adapts to highly integrated electronic needs, and optimizes signal layout and thermal management. - Convinced surface treatment: using immersion gold (ENIG) process to enhance the corrosion resistance and welding reliability of the board surface to ensure long-term stable operation. - Advanced packaging technology: Integrate FC-CSP and PBGA technology to provide short interconnect solutions for high I/O counts, achieving higher layout density and excellent electrical performance.
Application Scenario
- Communication network hardware: oriented to fields such as data centers, server architectures, and communication infrastructure to meet extremely high signal processing and transmission rate requirements. - Consumer electronic equipment: Suitable for consumer electronic products such as smartphones and laptops, supporting the delicate craftsmanship and compact internal design of the equipment. - Industrial automation systems: Strengthen the reliability and performance of industrial control panels, sensors and instruments to adapt to continuous work requirements in harsh environments. - Emerging technology fields: Assist the development of innovative technologies such as 5G, new energy, and electric vehicles, and provide high-intensity circuit support and cooling solutions. - Medical and educational equipment: Provide stable circuit substrates for high-precision medical instruments and educational and scientific research equipment to ensure accurate transmission of key data.
