Product Details
Product Introduction
The highly conductive multi-layer PCB circuit board provided by Mingzhenghong Electronics Co., Ltd. uses FR-4 base material and is compatible with 4-layer circuit layout design. The outer copper layer is 8OZ thick and the inner copper layer is 4OZ thick. It has excellent conductivity and Thermal dispersibility. The product size is 182.6 x 164.52 mm, the plate accuracy is controlled within ±0.13mm, the minimum line width/line spacing can reach 0.3mm/0.3mm (12mil/12mil), the minimum aperture is 0.3mm (12mil), and the plate thickness specification is 2.0 mm±0.2mm. The surface treatment adopts immersion gold process to ensure excellent welding effect and long-term anti-corrosion performance. This product is widely used in power supply systems, smart metering, communication equipment, security monitoring, LED radiators, automotive electronics and other fields to meet the needs of high-density integrated circuit design and high-power electronic equipment. Our thick copper PCB product line supports outer copper thickness up to 12OZ and inner copper thickness up to 8OZ, providing a strong and stable circuit foundation and assembly services for your various electronic hardware.
Advantages and features
1. High conductivity: Using FR-4 base material, the maximum outer copper thickness is 8OZ, and the inner copper thickness is 4OZ, which improves the current carrying capacity and reduces the heat generation. 2. High-precision design: Precisely control the plate size within ±0.13mm and the minimum line width/line spacing of 0.3mm/0.3mm to meet the needs of complex circuits. 3. Excellent heat dispersion: Reasonable layout and material selection help effectively disperse heat energy and improve the thermal stability and service life of components. 4. Surface immersion gold process: ensures excellent welding effect and long-term corrosion resistance, and improves product reliability and durability. 5. Strong compatibility: Product specifications adapt to diverse applications and support the installation requirements of high-density integrated circuits and high-power equipment.
Application Scenario
1. Power management system: Reliable current carrier ensures the smooth operation of the power system and is suitable for demanding power supply designs. 2. Intelligent metering equipment: precise circuit design and high conductivity performance improve metering accuracy and stability. 3. Communication and broadcasting equipment: The high-density board design meets the miniaturization and integration requirements of communication equipment. 4. Security monitoring system: Long-term stable power supply ensures the sustainable operation of monitoring equipment, and is suitable for demanding security electronics. 5. LED lighting and heater: Excellent heat dissipation performance extends the life of LED products and improves efficiency. 6. Automotive electronics applications: It can withstand the strict environmental conditions and power requirements of the automotive industry and adapt to the innovative development of automotive electronics.
