Product Details
Product Introduction
Our company's refined 26-layer high-density interconnect (HDI) circuit board is specially designed for embedded systems and has three important features: First, the board is complex, supports multi-layer design up to 26 layers, and can achieve a maximum 34-layer PCB Production. Second, the board adopts high-precision laser drilling technology, implements secondary blind hole and buried hole technology, and triple lamination process to ensure the stability and reliability of the inner circuit. Third, a thick hard gold plating of up to 200 micro inches is applied to the gold finger area, which is significantly higher than the conventional 10-30 micro inches. This not only ensures excellent wear resistance, but also optimizes the quality of electrical connections. The total thickness of the circuit board is 2.4 mm. The outer layer is 1 ounce and the inner layer is half an ounce copper thickness. It uses FR-4 TG 180 high temperature material to meet the minimum aperture of 0.2 mm and the minimum line width/line spacing of 4 mil. The size is 210 mm. ×121 mm, the surface treatment is electroplated nickel gold (ENIG) process.
Advantages and features
1. High-level design: supports complex 26-layer multi-layer design, can be expanded to 34 layers, and is suitable for extremely demanding application environments. 2. Precision processing technology: The use of advanced laser drilling and secondary blind hole and buried hole technology, combined with three lamination processes, ensures a stable and reliable connection between circuit layers. 3. Reinforced gold finger coverage: 200 micro-inch thick hard gold covers the gold finger area, significantly improving wear resistance and electrical connection reliability. 4. High-performance material application: The use of FR-4 TG 180 high-temperature plate ensures that the product still maintains good performance in high-temperature environments. 5. Tight size control: Meets the high-precision requirements of 0.2 mm micro aperture and 4 mil line width/line spacing, and adapts to strict design requirements in details.
Application Scenario
1. Communications industry: Hardware facilities suitable for high-frequency transmission and big data processing such as high-speed network equipment, servers, and base stations. 2. Aerospace: Meets the high reliability, long-term durability and environmental adaptability requirements of avionics equipment for PCB. 3. Military industry: Meet the PCB requirements of military equipment for harsh environment resistance, high-density wiring and complex system integration. 4. High-end consumer electronics: suitable for core circuit boards of smartphones, smart wearable devices and other portable electronic products with high performance requirements. 5. Medical equipment: Suitable for use in precision medical instruments and equipment that require complex functions and limited space.
