Product Details
Product Introduction
Mingzhenghong Electronics Co., Ltd. focuses on the field of high-precision PCB, especially in the IC substrate testing sector. Our IC substrate uses high TG180 FR-4 material, ITEQ (IT180A), with a size of 320X410mm (about 12.598X16.142 inches), a board thickness of 5.0mm, a minimum aperture of 0.4mm, and is equipped with an outer copper thickness of 30um and 18um & 35um inner copper thickness to meet high performance requirements. The product supports a minimum line width and line spacing of 4mil (0.1mm), and is equipped with a solderless gold (ENIG) surface treatment process, with a black solder mask and white silk screen as standard. This IC substrate is a high-density interconnect (HDI) board that uses laser drilling technology and has full-layer blind and buried via capabilities. HDI PCB is well-known for its wide application in high-tech industries such as automobiles, aerospace, telecommunications and communications. At the same time, it is also widely used in IC substrate, IC testing, semiconductor and other fields. Our products comply with the international IPC-II standard in terms of quality and technology, and have impedance control functions, fully demonstrating the high quality and reliability of the products.
Advantages and features
- Use high TG180 FR-4 material to provide good heat resistance and ensure stability and reliability under thermal stress. - Accurate size (320X410mm, 5.0mm plate thickness), the minimum hole diameter reaches 0.4mm, meeting the precision requirements. - Highly conductive outer layer of 30um copper and inner layer of 18um & 35um copper ensure excellent electrical performance. - HDI technology enables blind hole and buried hole design to improve signal integrity and wiring density. - ENIG surface treatment plus impedance control prolongs product service life and maintains high-frequency transmission stability. - Black solder mask and white silk screen, designed with clear markings to facilitate assembly and inspection.
Application Scenario
- Semiconductor manufacturing and IC testing environments, where extremely high stability and precision are required. - In the fields of aerospace and automotive electronics, there are strict requirements for testing high-performance electronic components. - High-speed circuit board testing in the communications industry, suitable for high-frequency communications technologies such as 5G. - New energy and industrial automation fields require high temperature resistance and high-density interconnection solutions. - Medical electronic equipment requires precise and highly reliable circuit board testing.
