Product Details
Product Introduction
The four-layer flexible circuit board produced by Mingzhenghong Electronics Co., Ltd. is made of high-quality polyimide material with good mechanical flexibility and thermal stability. The surface treatment of this product is gold immersion process, and the thickness of the gold layer is 2 microns, which not only ensures solderability but also prolongs the life of the product. The product cover layer adopts yellow cover film and is matched with electromagnetic film to effectively improve the signal transmission stability and anti-interference ability. The product is also equipped with polyimide and FR-4 reinforcement board to enhance the mechanical stability of the overall structure.
Advantages and features
- High-quality polyimide material enhances the mechanical flexibility and thermal stability of the circuit board and adapts to harsh environments; - 2-micron immersion gold surface treatment technology improves welding performance and extends product service life; - Precision manufacturing, minimum line width /The line spacing is 2mil (approximately 0.051mm), and the minimum aperture is 0.15mm, meeting the needs of high-density wiring; - The yellow covering film is combined with the electromagnetic layer to ensure signal stability and anti-interference performance; - Introducing impedance control technology to ensure the consistency of electronic signal transmission and reliability to improve product performance.
Application Scenario
- LCD screen control panels and other display devices, ensuring delicate images and fast response times; - Mobile communication devices, such as smartphones and tablets, supporting high-speed data transmission and tight space layout; - Aerospace electronic systems, adaptable to extreme environments and Stability requirements for complex cable layouts; - High-end consumer electronics and complex electronic equipment, such as laptops and advanced cameras, provide one-stop complex circuit solutions; - Medical equipment, ensure accurate signal collection and processing, and promote the development of equipment miniaturization .
