Product Details
Product Introduction
The lead-free immersed tin 6-layer high-frequency 5G PCB board launched by Mingzhenghong Electronics uses FR-4 TG150 high-temperature material, and the inner and outer layers are laid with 2 ounces of heavy copper to ensure the conductive stability of the printed board under high loads. The product size is 135 x 244.4 mm, the line width/line spacing reaches the fine level of 0.1 mm, and the minimum aperture is 0.15 mm, providing excellent electrical performance and signal transmission capabilities. The thickness of the plate is controlled at 1.0 mm ± 0.1 mm. The surface treatment technology is immersion tin. The thickness of the immersion tin is 1 micron. It has good weldability and environmental protection performance and meets RoHS standards. This product is widely used in high-speed communication fields such as computer motherboards/daughterboards and mobile phones. Its short shipping cycle and various surface treatment options can meet the customized needs of different customers. Mingzhenghong Electronics Co., Ltd. relies on its precise processing technology and strict quality management system to be your trusted circuit board manufacturing partner.
Advantages and features
- Using FR-4 TG150 high temperature and heat-resistant material to ensure the stability and durability of the PCB board. - 2-ounce heavy copper layout on the inner and outer layers optimizes conductivity and heat distribution efficiency under high loads. - The product has high precision, with line width/line spacing up to 0.1 mm and a minimum aperture of 0.15 mm, meeting the needs of fine circuit design. - The plate thickness is precisely controlled at 1.0 mm ± 0.1 mm, ensuring assembly consistency and mechanical strength. - The surface treatment adopts environmentally friendly lead-free tin immersion process, which provides good welding performance and long-term reliability, and complies with RoHS environmental standards.
Application Scenario
- High-speed communication equipment, including 5G base stations, routers, switches and other communication motherboards/sub-boards, to optimize signal transmission. - Smartphones and tablets, electronic devices used in high-frequency signal processing and fast data exchange. - Complex computer systems, suitable for applications requiring high electrical performance and high-density multi-layer printed circuits. - Emerging automated industrial equipment and medical instruments ensure high-precision operation of equipment and stable transmission of signals. - High-end consumer electronics, consumer electronics products that meet special requirements for PCB performance and dimensional accuracy.
