Product Details
Product Introduction
Mingzhenghong Electronics Co., Ltd.'s 6-layer 1.2mm FR-4 TG170 5G antenna PCB circuit board is specially designed for the 5G communication field and has a high-density multi-layer circuit layout. The board thickness is 1.2mm±0.12mm, the outer copper layer is about 1 ounce, and the inner layer is 0.5 ounces to ensure the stability of signal transmission and power distribution. Using FR-4 TG170 as the material improves the thermal stability of the board and adapts to the operating requirements of 5G products at higher temperatures. The minimum drilling is 0.25mm (10mil), the minimum line width and line spacing is 0.2m (8mil), and the board size is 120mm x 130mm. This product uses a variety of surface treatment technologies such as OSP, leaded tin spray, lead-free tin spray, immersion gold, immersion silver, immersion tin, etc. to adapt to different welding and protection needs. This PCB is designed to be used in a wide range of applications such as automobiles, intelligent communications, computers, industrial control systems, LEDs, power supplies, medical equipment, etc. It supports impedance control and multi-color selection of solder mask ink and silk screen printing. Its features include the smallest BGA pad is 10mil, 0.35mm PITCH, and the BGA pad is drilled with 6mil through holes, filled with resin and covered with copper plating to meet the packaging needs of SMT chip processing. The products are guaranteed in terms of technology, performance and quality management, and have passed ISO9001, ISO14001 and other international certifications to meet the global market demand for high-precision 5G antenna PCBs.
Advantages and features
- Multi-layer precision layout, taking into account signal stability and thermal performance: using TG170 high glass transition temperature material to provide excellent thermal stability and suitable for high temperature environments. - Fine minimum line width and line spacing: 0.2mm (8mil), ensuring high density and accuracy of circuit design. - Multiple surface treatment options to meet diverse welding needs: OSP, spray tin, immersion gold, etc. to ensure the performance and reliability of circuit boards in different applications. - Enhanced power distribution design: The inner layer is 0.5 ounces and the outer layer is 1 ounce copper thick to ensure stable power transmission. - High-precision drilling is compatible with SMT packaging: to meet the layout requirements of precision components, and the BGA pad design meets fine-pitch soldering standards.
Application Scenario
- 5G communication field: Antennas and related components specially designed to support fifth-generation mobile communication technology. - Intelligent communication equipment: suitable for intelligent communication hardware that requires high signal stability and strong heat resistance. - Industrial control systems: Suitable for complex industrial automation applications that require precise power management and stable signal processing. - Medical equipment: High-precision design ensures the accuracy and reliability of signal transmission in medical equipment. - Automotive electronics: Adapt to the automotive industry's high heat resistance and high electrical performance requirements for PCBs.
