Leading the trend of precision electronic testing

As technology continues to advance, the demand for precision testing of electronic components continues to increase. Mingzhenghong Electronics Co., Ltd. focuses on the development of HDIPCB dedicated for high TG IC testing, aiming to provide customers with high stability and high reliability solutions.

Excellent product specifications and performance

Our HDI PCB uses high TG180 FR-4 material to ensure excellent stability and reliability under extreme thermal stress. The product size is 320X410mm , the plate thickness is 5.0mm , and the minimum hole diameter is 0.4mm . In addition, the highly conductive 30um outer copper layer and 18um & 35um inner copper thickness perfectly meet high-performance requirements.

Technical Advantages—HDI and Signal Integrity

HDI technology enables our products to have blind via and buried via designs , significantly improving signal integrity and wiring density. In addition, equipped with ENIG surface treatment and impedance control, our products are more competitive, extend their service life, and ensure the stability of high-frequency transmission.

Broad scope of application

Our precision high-TG IC test-specific HDIPCB is not only suitable for semiconductor manufacturing and IC testing environments, but its high-performance characteristics also meet the stringent requirements of aerospace, automotive electronics, 5G communications, medical equipment and other fields.

Summarize

Mingzhenghong Electronics Co., Ltd. has always been committed to providing customers with the highest quality electronic testing solutions. Our dedicated HDIPCB for high TG IC testing, with its excellent performance and stability, will become an ideal choice for users who pursue high precision and reliability. Choose us and you will get industry-leading technology and support.