Introduction

The Precision 30-Layer HDI High-Density Communication Circuit Board is at the forefront of electronic innovation, designed to meet the demands of high-end applications in smartphones, telecommunications, and IoT devices. Made of high TG ITEQ IT-180A material, it ensures unparalleled performance even in the most challenging environments.

Key Features

This PCB showcases several remarkable features, including:

• High TG ITEQ IT-180A material to ensure long-term stability and thermal resistance.
• A 30-layer design that supports multi-layer laser drilling and precision bonding techniques, catering to complex circuit configurations.
• Advanced via technology, allowing for minimum via sizes of 0.2mm and laser aperture down to 0.1mm, ensuring optimal signal integrity.
• Excellent line design with a minimum width and spacing of 3mil (0.075mm), perfect for high-density component placement.
• ENIG surface treatment to enhance solder joint strength and oxidation resistance, extending product lifespan.
• Compliance with IPC-II standards and precise impedance control requirements to guarantee circuit performance.
• Multiple international certifications (UL, TS16949, ISO9000), emphasizing product reliability and high standards.

Applications

The Precision 30-Layer HDI PCB is suitable for various applications, including:

• High-end smartphone manufacturing, particularly for devices requiring precision and compact layouts.
• Communication equipment such as base stations, routers, and switches that demand high-speed signal transmission and processing.
• Mobile communication sectors including 4G/5G network devices, fulfilling the needs for high-frequency and high-speed data communication.
• IoT devices designed for smart homes and wearables, which require compact PCB space and signal integrity.
• High-precision electronic computing and storage devices that necessitate reliable circuit boards capable of processing high-speed data tasks.
• Automation and control systems in industrial and automotive applications, which require precision and reliability in data exchange.

Conclusion

In conclusion, the Precision 30-Layer HDI High-Density Communication Circuit Board presents a powerful solution for modern electronic requirements, highlighting advanced manufacturing technologies and unparalleled performance features. It stands as a cornerstone for innovation in high-tech fields, driving reliability and efficiency across numerous applications.