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Precision 30-layer HDI high-density communication circuit board - ideal for meeting the needs of high-end smartphones

04 10,2024
Mingzhenghong Electronics Co., Ltd.
Industry Information
Our latest precision 30-layer HDI high-density communication circuit board uses high TG ITEQ IT-180A material to ensure extreme signal stability and circuit performance, meeting the needs of the modern electronics market for high precision and tight layout.

introduction

In the context of the rapid development of modern electronic communications, precision 30-layer HDI high-density communication circuit boards have emerged. This circuit board uses high TG ITEQ IT-180A material, which enables it to perform well in high-temperature and high-performance application environments, especially in the face of the stringent requirements of smartphones and high-end communication equipment.

Features

  • High TG ITEQ IT-180A material: This material ensures long-term stability and heat resistance of the circuit board in high-temperature applications.
  • 30-layer high-density design: supports multiple laser drilling and precision compression bonding processes to meet the needs of complex circuit configurations.
  • Micro-through hole technology: the minimum through hole is 0.2mm and the laser aperture is 0.1mm, ensuring stable signal transmission.
  • Excellent circuit design: The minimum line width and line spacing are 3mil (0.075mm), which is suitable for high-density electronic component layout.
  • Immersion gold (ENIG) surface treatment: enhances welding strength and anti-oxidation performance, and improves product life.
  • Multiple international certifications: in compliance with UL, TS16949, ISO9000 and other standards, emphasizing the high reliability of products.

Application

Precision 30-layer HDI high-density communication circuit boards are widely used in many fields, including:

  • High-end smartphone manufacturing, meeting devices with high requirements for precision and layout.
  • Communication equipment, such as base stations, routers, switches and other high-speed signal transmission and processing applications.
  • The mobile communications field, including 4G/5G network equipment, supports high-frequency and high-speed data transmission.
  • Internet of Things (IoT) devices, smart homes, and wearable devices that require compact PCB space and high signal integrity.
  • High-precision electronic computing and storage equipment, such as servers and high-performance computers.
  • Automation and control systems are responsible for a large amount of data interaction and require highly reliable circuit boards as core components.

in conclusion

In summary, the precision 30-layer HDI high-density communication circuit board is an indispensable and important part of the high-end electronics market. Its excellent performance, excellent heat resistance and rigorous design ensure that it can continue to lead the industry trend in the current highly competitive market.

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