High TG edge copper-plated multilayer PCB: the best choice

明政宏电子有限公司自豪地推出其创新产品——高TG边缘镀铜多层印制电路板（PCB） 。该产品采用优质的TG250级FR-4材料，确保在高温环境下的卓越稳定性和可靠性，成为了众多行业的首选。

Features

The thickness of this PCB is 3.0mm, and combined with edge copper plating technology, it can achieve effective conductive layer connection, greatly improving the performance and reliability of the circuit board. Specific advantages include:

• High-quality TG250 grade FR-4 material ensures excellent stability in high temperature environments;
• Adopt 3.0mm board thickness and edge copper plating technology to achieve effective connection of the conductive layer at the edge of the board;
• The surface treatment is hard gold 15u, which further optimizes the weldability and conductivity and enhances the durability of the product;
• Maintain a minimum aperture of 0.3mm and a line width and spacing of 5mil to meet precision machining standards;
• Strictly follow IPC-II standard production to ensure product high quality and long-term reliability.

Scope of application

High TG edge copper-plated multi-layer PCB boards are widely used in high-speed transmission equipment with strict requirements on stability and high temperature resistance, especially in the following areas:

• 5G communication technology, such as base stations and network equipment;
• High-tech industries that require precision circuit control, such as semiconductor testing equipment;
• The military and aerospace industries have extremely high requirements for circuit board performance;
• Medical equipment and automotive electronic systems require highly reliable circuit board solutions.

Conclusion

Choose Mingzhenghong Electronics Co., Ltd.'s high-TG edge copper-plated multi-layer PCB board to ensure that your products still perform well in high-temperature environments and improve the overall performance of the circuit. Our PCBs are based on high quality and high reliability, aiming to provide customers with the best solutions and help your business flourish.