Introduction

As the demand for high-performance electronics continues to rise, especially in embedded systems, the need for reliable printed circuit boards (PCBs) has become critical. Our high reliability 26-layer HDI (High-Density Interconnect) PCB stands out in the market, designed to meet the intricate demands of modern technology.

Design and Construction

Featuring a sophisticated design capable of supporting complex multi-layer structures, our 26-layer HDI PCB can be expanded to accommodate up to 34 layers, tailored for applications with stringent requirements. The advanced laser drilling techniques employed not only ensure high precision but facilitate the implementation of blind buried hole technology, achieving a stable and reliable interconnection among the layers.

Key Features

1. High Layer Design

The board supports a complex 26-layer design which can be extended to 34 layers, making it suitable for extremely demanding applications.

2. Precision Fabrication Technology

Utilizing advanced laser drilling, alongside blind and buried hole technologies, our PCBs ensure robust inter-layer connections through a meticulous three-press lamination process.

3. Enhanced Gold Finger Coverage

Capable of accommodating up to 200 micro-inches of hard gold plating on the finger region, our PCB significantly improves wear resistance and electrical connection reliability.

4. High-Performance Material Application

Constructed using FR-4 TG 180 high temperature materials, our boards maintain excellent performance in high-temperature environments, making them ideal for various applications.

5. Tight Dimension Control

The design meets strict demands with a minimum hole diameter of 0.2mm and a minimum line width/spacing of 4 mil, ensuring compatibility with detailed design requirements.

Applications

Our 26-layer HDI PCBs have a wide range of applications including:

• Telecommunications: Ideal for high-speed networking equipment and data processing hardware.
• Aerospace: Designed to meet the rigorous demands of aviation electronics for reliability and durability.
• Military: Offers high density routing and integration for military technologies in challenging environments.
• High-End Consumer Electronics: Perfect for advanced smartphones, wearables, and portable devices requiring superior performance.
• Medical Devices: Suited for sophisticated medical instruments that necessitate both complexity and compactness.

Conclusion

Our advanced 26-layer HDI PCB is engineered for excellence, ensuring high reliability and performance tailored for challenging embedded applications. With innovative design, precision manufacturing, and high-performance materials, these boards are set to power the electronics of tomorrow.