Introduction

In the rapidly evolving landscape of embedded systems, the need for high reliability and performance is paramount. Our 26-layer High Density Interconnect (HDI) PCB is expertly designed to meet these demands, featuring cutting-edge technology and materials for superior performance.

Key Features

• High Layer Count Design: Supports complex multi-layer designs up to 26 layers, expandable to 34 layers, suitable for demanding applications.
• Precision Processing Technology: Employs advanced laser drilling techniques and two-stage blind and buried hole processing, ensuring reliable interlayer connections.
• Enhanced Gold Plating: Gold fingers are coated with a hard gold layer of 200 microinches, significantly improving wear resistance and electrical connection reliability.
• High-Performance Material Utilization: Constructed from FR-4 TG 180 high-temperature material, ensuring excellent performance in high-temperature environments.
• Tight Dimensional Control: Meets stringent requirements with a minimum hole size of 0.2mm and a minimum line width/spacing of 4 mils.

Applications

This 26-layer HDI PCB is highly versatile, catering to various sectors:

• Communication Industry: Perfect for high-speed networking equipment, servers, and base stations.
• Aerospace: Meets stringent reliability and durability requirements for avionics equipment.
• Military Sector: Designed for military devices needing high-density interconnections and complex integrations.
• High-End Consumer Electronics: Ideal for performance-critical applications in smartphones, wearable devices, and portable electronics.
• Medical Equipment: Suitable for precise medical devices needing complex functionalities in limited space.

Conclusion

Our 26-layer HDI PCB combines unmatched reliability and advanced manufacturing techniques, making it a prime choice for developers and engineers in various high-demand industries. Explore how our technology can elevate your embedded systems to new heights of performance.