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High Reliability 26-Layer HDI High-Density Printed Circuit Board (HDI PCB) for Advanced Applications

29 01,2025
Mingzhenghong Electronics Co., Ltd.
Product description
Discover our cutting-edge 26-layer HDI high-density printed circuit boards (HDI PCB), designed for embedded systems with advanced features such as precision laser drilling, strong gold plating, and high-temperature materials, ensuring reliable performance in critical applications.

Introduction to 26-Layer HDI PCB

In the fast-evolving tech landscape, electronic devices require more sophisticated circuit solutions. Our high reliability 26-layer HDI PCB offers the culmination of advanced manufacturing processes and high-performance materials, specifically engineered for embedded systems where reliability and precision are paramount. With the ability to support complex designs and high-density interconnections, this PCB stands as a cornerstone for modern electronic applications.

Key Features of Our 26-Layer HDI PCB

1. High Layer Count Design

Our PCB offers an impressive capacity to integrate up to 26 layers, with the flexibility for production extending to 34 layers. This permits intricate circuit layouts that are essential for the most demanding applications in diverse industries, including telecommunications and aerospace.

2. Precision Manufacturing Techniques

Utilizing state-of-the-art precision laser drilling technology, our manufacturing process implements both blind and buried hole techniques. This approach is coupled with three pressing stages, ensuring a reliable interconnection between layers, which is vital for maintaining high signal integrity.

3. Enhanced Gold Plating

The gold plating on the finger region is elevated to 200 microinches, a marked improvement over standard offerings. This enhancement provides exceptional wear resistance and significantly boosts the reliability of electrical connections, which are critical in high-stress environments.

4. High-Performance Materials

Constructed from FR-4 TG 180 high-temperature material, our HDI PCBs are engineered to retain excellent performance even under high heat conditions. This is particularly advantageous for applications that experience thermal stress.

5. Tight Dimensional Control

Our boards meet stringent specifications with a minimum hole diameter of 0.2 mm and line widths/spacing as small as 4 mil. Such precision is critical for intricate designs that demand a high level of detail.

Applications of 26-Layer HDI PCB

The versatility of our HDI PCBs allows them to serve a myriad of industries:

  • Telecommunications: Ideal for high-speed networking equipment, servers, and base stations.
  • Aerospace: Meets stringent reliability and durability requirements for aerospace electronics.
  • Defense: Geared towards military applications with demands for robust performance in harsh environments.
  • Consumer Electronics: Perfect for high-performance smartphones, wearables, and sophisticated portable devices.
  • Medical Devices: Suitable for advanced medical equipment requiring compact and complex circuitry.

Conclusion

Our high reliability 26-layer HDI PCB is engineered to surpass the challenges of modern technology. With cutting-edge features such as advanced manufacturing techniques, enhanced gold plating, and high-performance materials, this PCB serves as an essential component for critical embedded system applications. Experience the prowess of our HDI PCB and elevate your electronic designs to new horizons.

26-layer HDI Board
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