High reliability 26-layer HDI high density printed circuit board

Our company's refined 26-layer high-density interconnect (HDI) circuit board is designed specifically for embedded systems and has three important features:
First, it supports complex multi-layer designs up to 26 layers, and can achieve 34-layer PCB production at the fastest speed, adapting to extreme demand environments.
The second is to use high-precision laser drilling technology, implement secondary blind and buried via technology, and 3-time pressing process to ensure the stability and reliability of the inner layer circuit.
Third, a 200 micro-inch thick hard gold plating layer is applied to the gold finger area to greatly improve the wear resistance and electrical connection quality, maximizing the service life of the product.

Core Advantages

1. High-layer design: Supports complex 26-layer design, expandable to 34 layers, perfectly adapting to harsh application environments.
2. Precision processing technology: Use advanced laser drilling and multiple pressing processes to ensure the stability and reliability of the connection between circuit layers.
3. Powerful gold finger coverage: 200 micro-inch hard gold plating, improves wear resistance and electrical performance, ensuring good signal transmission.

High performance material applications

The circuit board uses FR-4 TG 180 high temperature material to ensure excellent thermal stability even in high temperature environments. At the same time, the controlled aperture is 0.2 mm and the line width/line spacing is 4 mil, meeting the market's strict requirements for product accuracy.

Scope of application

• Communications industry: Applicable to high-frequency transmission hardware such as high-speed network equipment, servers, base stations, etc.
• Aerospace: Meets stringent requirements for high reliability and long-term durability in avionics.
• Military industry: Meet the PCB requirements of military equipment for high-density wiring and complex system integration.
• High-end consumer electronics: suitable for high-performance portable products such as smart phones and smart wearable devices.
• Medical equipment: Suitable for applications in precision medical instruments that require complex functions and have limited space.

The total thickness is 2.4mm, with 1 ounce copper thickness on the outer layer and half an ounce copper thickness on the inner layer, ensuring stable performance and providing the best solution for various high-end markets.

Choosing our company's high-reliability 26-layer HDI high-density printed circuit board is not only a trust in product quality, but also a forward-looking grasp of future technological trends. Let us work together to create a brilliant technological future!