Product Introduction

The high-precision 34-layer laser blind via PCB produced by Mingzhenghong Electronics Co., Ltd. is a high-performance multi-layer printed circuit board based on FR-4 TG180 ITEQ (IT180A) material. This product uses back drilling technology and laser blind via technology to ensure the connectivity between circuits and signal integrity.

Product Features

The specific parameters of this circuit board include:

• Thickness: 5.0mm
• Minimum aperture: 0.3mm
• Minimum line width and line spacing: 4mil (0.1mm)
• Outer copper thickness: 35um
• Inner layer copper thickness: 18um and 35um
• High aspect ratio: 17:1
• Copper thickness in hole: at least 25um

The distortion and warping ratio of the circuit board is controlled within 0.5% , which is far lower than the 0.75% requirement of the IPC-II standard, ensuring customers' reliable use in high-performance electronic testing environments.

Advantages and features

1. Advanced technology is used to achieve high-precision circuit connectivity and ensure complete signal transmission.
2. Adopt FR-4 TG180 ITEQ (IT180A) material to meet complex design requirements.
3. Minimum aperture and minimum line width are suitable for high-density layout.
4. ENIG surface treatment provides excellent conductivity and anti-oxidation performance.
5. Strictly control the ratio of twist and warping to ensure stability.

Scope of application

Our high precision 34-layer laser blind via PCB is widely used in:

• Semiconductor test equipment
• Industrial Automation and Medical Equipment
• High-density electronic integrated systems, such as communications and 5G networks
• New energy products, including solar inverters and electric vehicles
• High-end consumer electronics

With the help of high-precision controlled lamination process, this product strictly prohibits the repair of circuits and solder mask, and is perfectly suitable for applications with strict requirements on stability and performance. Through strict quality control, we ensure that every customer can get the best performance in their electronic testing environment.