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High-performance precision high-speed multi-layer IC substrate and PCB customization services - Mingzhenghong Electronics Co., Ltd.
2024/10/03
Mingzhenghong Electronics Co., Ltd.
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Mingzhenghong Electronics Co., Ltd. provides advanced high-speed PCB and multi-layer IC substrate customization services, using cutting-edge manufacturing technology to meet semiconductor-level fine requirements, suitable for communications, consumer, industrial and other fields.

Advantages of Precision High-Speed ​​Multilayer IC Substrates and PCBs

With the continuous requirements for performance and reliability of electronic equipment, Mingzhenghong Electronics Co., Ltd. provides customers with high-performance multi-layer IC substrates and high-speed PCB customization services, combined with cutting-edge manufacturing technology, in line with semiconductor-level fine requirements.

Features

  • Advanced Manufacturing: Based on cutting-edge PCB manufacturing technology, ensuring the ultimate performance and stability of the circuit board.
  • Ultra-fine line design: supports minimum line width/spacing of 0.075mm and via diameter of 0.2mm, effectively improving signal transmission efficiency.
  • High-level IC substrate: supports up to 8-layer designs, optimizes signal layout and thermal management to meet the needs of highly integrated products.
  • Confirmed surface treatment: Using ENIG process to enhance corrosion resistance and welding reliability, ensuring long-term stable operation.
  • Advanced packaging technology: Combining FC-CSP and PBGA technologies to provide short interconnect solutions and achieve higher layout density and electrical performance.

Scope of application

Our multi-layer IC substrates and high-speed PCBs are widely used in many fields:

  • Communication network hardware: for data centers and communication infrastructure, meeting the needs of high signal processing and transmission rates.
  • Consumer electronics: Applicable to products such as smartphones and laptops to support their delicate craftsmanship and compact design.
  • Industrial Automation Systems: Enhance the reliability of industrial control panels, sensors, and instruments to adapt to use in harsh environments.
  • Emerging technology fields: Provide strong circuit support and heat dissipation guarantee for cutting-edge technologies such as 5G, new energy and electric vehicles.
  • Medical and educational equipment: Provide important circuit substrates for high-precision instruments to ensure accurate transmission of key data.

Contact Us

For more information or customized services, please visit our official website. We look forward to cooperating with you.

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