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High-performance multi-layer IC substrate and high-speed PCB solutions | Mingzhenghong Electronics
2024/10/07
Mingzhenghong Electronics Co., Ltd.
Special report
Mingzhenghong Electronics Co., Ltd. specializes in providing high-performance multi-layer IC substrates and high-speed PCB customization services to meet the stringent requirements of communications, consumer electronics, industrial automation and emerging technology fields. We use advanced circuit board manufacturing technology to achieve ultra-fine line design and high-level IC substrates, providing reliable signal transmission and heat dissipation solutions for your electronic products.

Why choose Mingzhenghong's high-speed PCB and multi-layer IC substrate?

Mingzhenghong Electronics Co., Ltd. is committed to providing customers with high-performance multi-layer IC substrates and high-speed PCB customization services. Our products use the most advanced circuit board manufacturing technology to meet the fine requirements of the semiconductor level. This means that in the ever-changing electronics market, customers do not need to worry about the stability of signal transmission and power distribution.

Technical advantages and features

  • Advanced Manufacturing: Using cutting-edge PCB manufacturing technology to ensure high performance and stability of the circuit board.
  • Ultra-fine line design: supports minimum line width/spacing of 0.075mm and via diameter of 0.2mm, effectively improving signal transmission efficiency.
  • High-Level IC Substrates: Design IC substrates with up to 8 layers to optimize signal layout and thermal management to meet the needs of highly integrated electronics.
  • High-quality surface treatment: ENIG process is used to enhance the corrosion resistance and welding reliability of the board surface.
  • Advanced packaging technology: Integrates FC-CSP and PBGA technologies to provide short interconnect solutions for high I/O counts and achieve excellent electrical performance.

Wide range of applications

Our multi-layer IC substrates and high-speed PCBs are suitable for a variety of applications:

  1. Communications Network Hardware: Meeting the high signal processing demands of data centers and communications infrastructure.
  2. Consumer electronics: Suitable for smartphones and laptops, enabling compact designs.
  3. Industrial automation systems: Enhance the performance of industrial control panels and sensors to adapt to harsh environments.
  4. Emerging technology fields: Assist in the development of 5G and electric vehicle technologies and provide strong circuit support.
  5. Medical and educational equipment: Provide stable circuit substrates for high-precision medical instruments.

Contact Us

If you need more information about our high-speed PCB and multi-layer IC substrates, please feel free to contact us. Mingzhenghong Electronics will wholeheartedly provide you with the best service and solutions.

Multilayer IC substrate
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