High-Performance Four-Layer Soft and Hard Composite PCB Solutions

30 10,2024

Mingzhenghong Electronics Co., Ltd.

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Discover Ming Zheng Hong Electronics' advanced four-layer soft and hard composite PCBs, engineered for high flexibility in demanding applications. Featuring OSP+ENIG surface treatment and 2OZ copper thickness, our PCBs are designed to meet the needs of power modules, 5G communication devices, antennas, and wearable technology. Experience exceptional performance, reliability, and customized impedance matching solutions.

https://shmuker.oss-cn-hangzhou.aliyuncs.com/data/oss/65aa3975b5fb0b089674052b/65af233dc2e9735675ca9aab/混合结构PCB4层-1.jpg

Unparalleled Flexibility and Performance

At Ming Zheng Hong Electronics, we understand the evolving needs of modern technology. Our four-layer soft and hard composite PCBs combine the flexibility of soft boards with the stability of hard boards, allowing for a versatile solution ideal for complex installation environments.

Advanced Features

Precise Manufacturing: With a thickness tolerance of 1.2mm±0.12mm and flexible areas measuring 0.15mm±0.03mm, we enable high-density wiring and create micro vias as small as 0.15mm.
Surface Treatment: Our OSP (Organic Solderability Preservative) combined with ENIG (Electroless Nickel/Immersion Gold) treatments ensures not only solder quality but also enhances corrosion resistance and electrical conductivity.
High Power Capacity: Featuring a sturdy 2OZ copper thickness, our PCBs are well-suited for high-power applications, ensuring stable performance under demanding conditions.
Customized Impedance Matching: Specialized stacking designs cater to unique impedance requirements, guaranteeing signal integrity in high-speed applications.

Figure 1: Four-Layer Soft and Hard Composite PCB

Versatile Applications

Our four-layer PCBs are specifically designed for:

Power module manufacturing, particularly where high power transmission and temperature resistance are critical.
5G CPE devices in the telecommunications industry, meeting high-frequency transmission demands while ensuring signal stability.
Antenna and RF modules, ideal for applications needing specific electrical performance and spatial considerations.
Wearable devices and smart electronics, where PCB bendability and reliability are paramount.
Medical devices and automotive electronics, requiring high precision that combines rigid impedance control with flexible wiring design.

Figure 2: Specialized Stacking Designs for Signal Integrity

In an ever-evolving technological landscape, our high reliability PCBs not only meet current market needs but also anticipate future developments. Experience exceptional performance and reliability with Ming Zheng Hong Electronics’ advanced solutions today.