Do you know what technology is behind smartphones, tablets, and wearable devices? 🤔 Let’s unveil the mystery of High Density Interconnect PCB (HDI PCB)!

What is HDI PCB?

High-density interconnect PCB (HDI PCB) is a printed circuit board technology that can provide higher circuit density and smaller size. It uses micro blind via and buried via technology, which allows larger wiring space and faster signal transmission. 🌟

Structural features and manufacturing process

HDI PCB has a multi-layer board structure, usually containing micro blind and buried vias, which are incredibly small, with common diameters ranging from 50 microns to 150 microns. The manufacturing process involves high-precision processes such as laser drilling and chemical copper plating, ensuring its excellent performance.

Market Application

HDI PCB is widely used in advanced electronic products such as smartphones, tablets, wearable devices, etc. For example, Apple's iPhone uses a large number of HDI PCBs, which is one of the secrets of its thinness and lightness yet powerful functions. 📱

Why is it important?

Understanding the structural characteristics, manufacturing process and market application of HDI PCB is of great significance to the development of the electronics industry. 🧐 After all, technological progress is inseparable from the improvement of every detail, and HDI PCB is the key part of these details.

Want to learn more about HDI PCB? Take action now! Let's step into the world of high-density interconnect PCB and discover the secrets behind electronic products. 😉