Mingzhenghong Electronics Co., Ltd. is proud to launch its latest innovative product - 8-layer high-density interconnect (HDI) rigid-flex PCB. This product combines the advantages of FR-4 (glass fiber) and polyimide (PI) materials and is designed to meet the needs of today's advanced electronic devices.
The design of this HDI board involves a number of advanced technologies to ensure its excellent performance in high-density wiring. Its minimum aperture is 0.125 mm, the minimum line width in the rigid area is 4 mil, and the minimum line width in the flexible area is 3 mil, which is very suitable for the needs of complex electronic systems.
In addition, the product surface is treated with ENIG (gold plating) technology, in which the coating thickness is 3 microns, which improves the conductivity and corrosion resistance and ensures long-term reliability. In terms of materials, both FR-4 and polyimide meet environmental protection standards and adapt to the market trend of sustainable development.
This product is widely used in:
Mingzhenghong Electronics Co., Ltd.'s 8-layer hard-flex HDI board, combined with high-density interconnection technology and durable environmentally friendly materials, is the ideal choice for modern high-end electronic devices to achieve complex layouts and high performance. We look forward to working with you to create more efficient electronic solutions.
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