The rapid rise of high-density integrated circuits has put forward higher requirements for the fine processing capabilities of PCBs (printed circuit boards). The article "Requirements of High-Density Integrated Circuits on PCB Fine Processing Capabilities" explores the specific aspects of this issue. First of all, small apertures have become a basic requirement for high-density circuits. Today's PCBs must have the technology to process micro-apertures to accommodate more compact circuit designs. 😂 Here's a joke, do you know why PCB manufacturers focus on small apertures? The answer is simple, because they hate the waste of "holes"! Secondly, high-precision alignment is also indispensable. For multi-layer PCBs, accurate inter-layer alignment directly affects the performance and reliability of the circuit. According to survey data, if the accuracy deviation exceeds 0.1mm, the PCB may face the risk of not working. Third, thinner lines and spacing force PCB manufacturers to adopt more advanced processing technology. From 0.4mm to thinner line width, this requires more precise etching and printing processes to achieve. In order to meet these standards, new processing equipment on the market, such as laser drilling machines and high-precision exposure equipment, are playing an irreplaceable role. By meeting the above requirements, companies can not only ensure high quality and high performance of their products, but also gain an advantage in market competition. Talk to your PCB supplier now to see if they can meet these high standards! 😎 In summary, despite the many challenges, the new requirements of high-density integrated circuits for PCB fine processing capabilities have undoubtedly promoted the advancement of technology and the development of the market. Let's wait and see!