Product Introduction

High-frequency application flexible rapid prototyping FPC board is our latest high-performance product, specially designed for the needs of high-end electronic devices. This product uses high-quality polyimide (PI) substrate, combined with a multi-layer composite structure including adhesive, low-loss cover film and high-frequency copper wire to ensure excellent performance in signal transmission.

Advantages and Features

• High-quality polyimide (PI) substrate enhances the high-frequency handling capability and electrical stability of FPC.
• Comprehensive multi-layer construction design ensures good flexibility and signal transmission effect.
• High-precision manufacturing supports minimum line width/line spacing of 0.06 mm/0.09 mm and minimum aperture of 0.15 mm.
• Precise impedance control, single-ended 50 ohms and differential pair 100 ohms, meets strict electrical performance standards.
• Implement immersion gold surface treatment to improve product durability and weldability.
• Rapid transformation service supports 24-48 hours of rapid delivery to meet urgent development needs.

Scope of application

This product is widely used in various high-end electronic devices, especially computer LCD screens, smart phones and medical devices, where rapid prototyping or small batch production is required.

In addition, the FPC board is also suitable for automation equipment, communication equipment and high-performance consumer electronics, especially in environments with high-frequency use and precise signal processing, such as wearable technology with flexible connectors, vehicle systems and industrial control.

Conclusion

Our high-frequency application flexible rapid prototyping FPC boards will provide strong support for your innovative design. Whether facing severe technical challenges or rapid changes in the market, our products can meet your needs and help achieve sustainable business growth.