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8-layer hard-flex HDI board: leading the innovation path of high-end electronic circuit solutions
2024/09/28
Mingzhenghong Electronics Co., Ltd.
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Mingzhenghong Electronics Co., Ltd.'s 8-layer hard-flex HDI board combines the characteristics of rigidity and flexibility. With its high-density interconnection technology and environmentally friendly materials, it is designed to meet the needs of high-end electronic products and has excellent performance in mobile communications, precision medicine, industrial automation and other fields.
https://shmuker.oss-cn-hangzhou.aliyuncs.com/data/oss/65aa3975b5fb0b089674052b/65af233dc2e9735675ca9aab/8层软硬结合HDI板-1.jpg

Product Introduction

The 8-layer high-density interconnect (HDI) rigid-flex board launched by Mingzhenghong Electronics Co., Ltd. is a major innovation in the field of circuit solutions. This product combines the advantages of FR-4 (ITEQ) and PI (polyimide), both rigid and flexible. The dimensions are 143.2 is35 microns.

Technical features

The design of this product has achieved multiple technological breakthroughs:

  • The minimum aperture is only 0.125 mm, the minimum line width in the rigid area reaches 4mil, the flexible area is 3mil, and the line spacing requires high precision. The rigid area is3miland the flex board area is2mil.
  • The surface is treated by the ENIG process and plated with a 3 micron thick gold layer, which greatly improves the conductivity and corrosion resistance and ensures the long-term reliability of the product.
  • The environmentally friendly design uses FR-4 and PI materials, which meets the modern market’s demand for sustainable products.

Advantages and features

The 8-layer soft-hard HDI board has the following significant advantages:

  • Innovative combination: Combining the stability of rigid PCB and the flexibility of flexible FPC to meet the complex layout requirements of advanced electronic equipment.
  • High-density interconnection: Small aperture and high-precision wiring are achieved through HDI technology, which is suitable for high-density electronic systems.
  • Strong durability: The ENIG process enhances durability and ensures excellent performance in various environments.
  • Environmentally friendly materials: Use materials that meet environmental standards and respond to the market trend of sustainable development.
  • Exquisite appearance: The combination of green solder mask and yellow covering layer makes the appearance neat and improves the durability and user experience of the product.

Scope of application

Our 8-layer soft-hard HDI board is widely used in the following fields:

  • Mobile Communications: Circuit solutions serving smartphones, wearable devices and other products.
  • Precision medical equipment: Meet the requirements for high precision and stability of medical equipment.
  • Industrial Automation: For redundant design and efficient operation of automation control systems.
  • High-end camera module: Improve the performance and stability of the imaging system.
  • Lighting system: Especially suitable for intelligent lighting control solutions that require curved surface installation or compact space.

Nowadays, the 8-layer soft and hard HDI board has become an indispensable circuit platform in high-end electronic equipment. We are committed to providing the highest quality solutions to meet your requirements for advanced circuit technology expectations!

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