Introducing the 8-layer soft and hard HDI board

Mingzhenghong Electronics Co., Ltd. is proud to introduce its latest innovative product - 8-layer high-density interconnect (HDI) rigid-flex board. This circuit solution fully demonstrates the perfect combination of rigidity and flexibility, with dimensions of 143.2 x 156.43 mm and thicknesses of 2.0 mm (rigid part) and 0.15 mm (flexible part).

Technical advantages

Our 8-layer HDI board uses FR-4 (ITEQ) and PI (polyimide) as the base material, making full use of their excellent characteristics to ensure the durability and environmental protection of the product. Its minimum aperture reaches 0.125 mm, the minimum line width in the rigid area is 4mil, and the flexible area is 3mil. The line spacing requirements are also high, the rigid area is 3mil, and the flexible board area is 2mil.
Through the ENIG process, the surface is plated with a 3-micron thick gold layer, which significantly improves the conductivity and corrosion resistance and ensures long-term reliability.

Product features

• Innovative combination: Combining the stability of rigid PCB with the flexibility of flexible FPC to meet the increasingly complex layout requirements of advanced electronic equipment.
• High-density interconnection: HDI technology enables smaller apertures and high-precision line width/line spacing, which is suitable for complex electronic systems with high-density wiring.
• Strong durability: treated with ENIG process to ensure long-term reliability of the product.
• Environmentally friendly materials: FR-4 and PI base materials meet environmental protection requirements and adapt to the market trend of sustainable development.
• Exquisite appearance: The combination of green solder mask and yellow covering layer is not only beautiful, but also enhances the product use experience.

Scope of application

This 8-layer HDI board has a wide range of potential applications and is particularly suitable for the following areas:

• Mobile communications: Provide high-density, large-capacity circuit solutions for smartphones and wearable devices.
• Precision medical equipment: Compatible with the needs of medical equipment for high precision and stability.
• Industrial automation: Suitable for automation control systems that require efficient operation.
• High-end camera module: Supports high-definition image collection by the camera module to improve imaging system performance.
• Lighting system: Intelligent lighting control system to meet the needs of curved design and compact space.

Summarize

Mingzhenghong Electronics' 8-layer high-density interconnect (HDI) rigid-flex board is not only an ideal choice for advanced electronic equipment, but also an innovative solution that promotes the development of the electronics industry. We look forward to providing customers with a more excellent circuit platform and jointly embracing the future of technology.